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Indian Trade Secretary: India's export performance is very good. India's service trade will soon reach 50% of the total trade volume.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)New Zealand plans to modify the "golden visa" to attract wealthy immigrants, and the New Zealand government is planning to modify its so-called "golden visa" program to attract more wealthy immigrants to invest in New Zealand. The active investor PLUS visa has always attracted the rich to New Zealand, bringing an average of NZ $1 billion (US$ 580 million) to New Zealand every year, but it has been sluggish since the rules changed in 2022. According to the data of Immigration New Zealand, in the past two years, only 35 applications were fully approved, equivalent to NZ $352 million in investment funds. In an interview in Wellington on Thursday, Finance Minister Nicola Willis said, "We realized that the previous government changed these settings, and we saw a significant drop in the number of investors. You can expect to see our announcement in this regard in the next few weeks. "

The weighted share price index of Taiwan Stock Exchange closed 0.6% higher at 23,046.80 points.The passenger throughput of airports in Shanxi Province exceeded 20 million passengers. The reporter learned from Shanxi Aviation Industry Group Co., Ltd. on the 12th that as of December 10th, the passenger throughput of airports in Shanxi Province exceeded 20 million passengers, 14 days earlier than that in 2019, realizing a new leap-forward development. (China News Network)Indian Trade Secretary: India will need more imports to maintain high growth, and should not be too worried about the trade deficit.

The USD/JPY rose more than 30 points against the Japanese yen in the short term and is now reported at 152.56.The USD/JPY rose more than 30 points against the Japanese yen in the short term and is now reported at 152.56.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)